產(chǎn)品具有晶粒細(xì)、純度高、成分均勻、含氧量低、球形度高等優(yōu)點(diǎn)。
牌號規(guī)格:
合金成分 |
固相線/℃ |
液相線/℃ |
應(yīng)用及特點(diǎn) |
Sn96.5Ag3.0Cu0.5 |
217 |
217 |
SMT無鉛焊接 |
Sn99Ag0.3Cu0.7 |
217 |
217 |
SMT無鉛焊接 |
Sn99.3Cu0.7 |
227 |
227 |
SMT無鉛焊接 |
Sn42Bi58 |
138 |
138 |
散熱器或熱敏感元件的焊接 |
Sn63Bi35Ag1 |
151 |
172 |
散熱器或熱敏感元件的焊接 |
焊粉規(guī)格:
Grade |
10%Maximum |
90%Minimum |
Less than 1% |
Oxygen content |
Package |
Less than |
Between |
Larger than |
|||
Type2 |
45µm |
45-75µm |
75µm |
≤90ppm |
5kg/ aluminum foil bag 20kg/ plastic bucket |
Tyep2.2# |
25µm |
25-63µm |
63µm |
≤90ppm |
|
Tyep2.3# |
38µm |
38-63µm |
63µm |
≤90ppm |
|
Tyep3 |
25µm |
25-45µm |
45µm |
≤100ppm |
|
Tyep4 |
20µm |
20-38µm |
38µm |
≤120ppm |
|
Tyep5 |
15µm |
15-25µm |
25µm |
≤140ppm |
|
Tyep6 |
5µm |
5-15µm |
15µm |
≤160ppm |